The global advanced packaging market is expected to be valued at USD 30.5 billion in 2023 and is projected to soar to USD 61.3 billion by 2033, driven by a strong compound annual growth rate (CAGR) of 7.2% from 2023 to 2033.
Advanced packaging has become a critical enabler of increased performance and reduced costs in semiconductor manufacturing. The technology has evolved to improve IC throughput, enhance overall functionality, and reduce manufacturing costs. Over the past five years, the demand for sophisticated packaging has surged, driven by the increasing adoption of semiconductor integrated circuits in automobiles, a key driver of this sector’s expansion.
The advancements in packaging technology have allowed for the development of high-density solutions, especially with the growing use of system-on-chip solutions. As semiconductor applications become more intricate, these advanced packaging techniques have become integral to supporting higher performance and miniaturization.
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A focal point of the sector’s growth has been the shift toward wafer-level packages and heterogeneous integration. These innovations have given rise to a new generation of advanced packaging solutions that are critical in meeting the evolving needs of industries reliant on cutting-edge semiconductor technologies.
Micro-electromechanical systems (MEMS) are expected to be widely used, which will further drive demand for embedded die packaging solutions. The technology is not new, but owing to its high cost and low yield, it has been tailored for certain uses.
Key Takeaways from the Advanced Packaging Market Study
- In terms of end user, the consumer electronics segment is set to dominate by exhibiting around 7.0% CAGR from 2023 to 2033.
- The USA advanced packaging industry is projected to create an absolute dollar opportunity of USD 4.7 billion through 2033.
- South Korea advanced packaging market is expected to be worth USD 3.7 billion by 2033.
- China advanced packaging market is likely to be worth USD 15.5 billion by 2033.
- The United Kingdom advanced packaging market is estimated to showcase a CAGR of 5.6% between 2023 and 2033.
“Electronic device performance has constantly been sought for a variety of applications, including industrial, automotive, consumer, and mobile ones. Key companies are projected to develop all integrated circuit packaging, including fan-out wafer-level packages (FOWLP), with the help of special electronic solutions such as insulators and conductors,” says a lead analyst at Future Market Insights.
Competitive Landscape: Advanced Packaging Market
Due to the demand for cutting-edge technology and quick-responding devices, renowned companies are set to dominate the global advanced packaging market. These businesses continue to have a competitive advantage in the market owing to the elevated need for distinctive solutions for various applications.
The industry is further anticipated to gain traction from continuous developments in technology such as wireless communications, tablets, and smartphones.
- Amkor Technology Inc.
- ASE Technology Holding Co. Ltd.
- China Wafer Level CSP Co. Ltd.
- ChipMOS Technologies Inc.
- FlipChip International LLC
- HANA Micron Inc.
- Jiangsu Changjiang Electronics Technology Co. Ltd.
- King Yuan Electronics Corp.
- Nepes Corporation
- Powertech Technology Inc.
Get More Valuable Insights into Advanced Packaging Market
Future Market Insights, in its new offering, provides an unbiased analysis of the advanced packaging market presenting historical demand data (2018 to 2022) and forecast statistics for the period from 2023 to 2033.
The study incorporates compelling insights on the advanced packaging market based on type (flip chip scale package, flip chip ball grid array, wafer level chip scale package, 5D/3D, fan out wafer-level packaging), end user (consumer electronics, automotive, industrial, healthcare, aerospace & defense), and region.
Advanced Packaging Market Outlook by Category
By Type:
- Flip Chip Scale Package
- Flip Chip Ball Grid Array
- Wafer Level Chip Scale Packaging
- 5D/3D
- Fan Out Wafer-level Packaging
- Others
By End User:
- Consumer Electronics
- Healthcare
- Industrial
- Aerospace and Defense
- Automotive
- Other
By Region:
- North America
- Europe
- Asia Pacific
- Latin America
- Middle East & Africa
About Future Market Insights (FMI)
Future Market Insights, Inc. (ESOMAR certified, recipient of the Stevie Award, and a member of the Greater New York Chamber of Commerce) offers profound insights into the driving factors that are boosting demand in the market. FMI stands as the leading global provider of market intelligence, advisory services, consulting, and events for the Packaging, Food and Beverage, Consumer Technology, Healthcare, Industrial, and Chemicals markets. With a vast team of over 400 analysts worldwide, FMI provides global, regional, and local expertise on diverse domains and industry trends across more than 110 countries.
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