Rise in Automation and Industry 4.0 Fuels the Industrial Electronics Packaging Market

Industrial Electronics Packaging Market

The global industrial electronics packaging market is predicted to register a CAGR of 4.1% over the forecast period, as per FMI’s analysis. The industry’s size is anticipated to increase from US$ 1,944.9 million in 2023 to US$ 2,906.73 million by 2033 end.

Surging industrial automation is projected to open up a plethora of opportunities for the industrial electronics packaging industry. Since industrial automation offers enhanced productivity, better workplace safety, and lower production cost, the technology is being adopted in multiple end-user industries like automotive, aerospace and defense, chemicals, pharmaceuticals, oil, and gas. Multiple industrial automation technologies depend chiefly on electronic components. As a result, the expanding manufacturing operations in emerging economies are projected to bolster the sales of industrial electronics packaging.

Key players in the industrial electronics packaging industry are addressing prevalent issues in the electronics industry by developing dedicated packaging solutions. These new industrial electronics packaging solutions are designed to lessen environmental impact by reducing CO2. The companies that are active in the market are offering innovative packaging solutions that help cut costs and protect industrial electronic components, thereby augmenting product adoption.

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Key Highlights of the Industrial Electronics Packaging Market:     

  • The North American industrial electronics packaging industry is projected to mark its dominance by attaining US$ 672.1 million by 2023. The region is projected to assume a CAGR of 3.9% over the forecast period. The United States market is expected to surpass total revenue of US$ 659.9 million by the end of 2023.
  • Europe region is anticipated to position itself as the second leading market in the forthcoming period. The region is projected to generate overall revenue of US$ 578.3 million in 2023.
  • Germany contributes significantly towards Europe market growth. German market shares a sizeable amount of revenue of US$ 384.8 million.
  • East Asia is the third leading region in the market. The region is projected to account for US$ 296.4 million by 2023 end. The region includes Japan, China, and South Korea- with Japan contributing a huge chunk to the regional growth and South Korea contributing the least from the group.
  • South Asia is projected to witness robust expansion over the forecast period. The region is projected to witness a CAGR of 4.9% over the forecast period. South Asia is anticipated to attain US$ 202.8 million by 2023 end.
  • The rigid packaging format holds a significant proportion of the market. By 2023 end, the market is expected to attain US$ 1,816.7 million. The segment is projected to witness a CAGR of 4% over the forecast period.

Level Up: Competitors Upping Their Game

  • In August 2022, DS Smith pushed ahead with testing fiber-based cardboard packaging composed of seaweed, straw, and more. The company has invested US$ 140 million in research and development to bolster its work in the circular economy. The program aims to discover prospects for fiber and plastic replacement capabilities of multitudinous materials to extend its range of sources for packaging.
  • In May 2022, ABB chose DS Smith’s updated automation system for Europe’s second-leading recovered fiber-based paper operation.

Top Key Players Covered-

  • DS Smith Plc.
  • Smurfit Kappa Group Plc.
  • UFP Technologies Inc.,
  • Sealed Air Corporation,
  • Achilles Corporation,
  • Desco Industries Inc.,
  • Botron Company Inc.
  • Kiva Container Corporation
  • Orlando Products Inc.
  • Delphon Industries LLC
  • Summit Container Corporation
  • Protective Packaging Corporation
  • Dou Yee Enterprises (S) Pte Ltd.
  • Dordan Manufacturing Company Inc.
  • GWP Group Limited
  • Pure-Stat Engineered Technologies Inc.
  • AUER Packaging GmbH
  • Emballages Cre-O-Pack International Inc.
  • Universal Protective Packaging Inc.

Asian Economies Hold Promising Investment Opportunities for Industrial Electronics Packaging Companies

North America is estimated to be the most prominent industrial electronics packaging market, the report also points to the robust growth in East Asia’s market attractiveness over the years to come. The East Asian market for industrial electronics packaging will thus remain a significant regional contender in the industrial electronics packaging landscape, according to FMI’s analysis.

In East Asia, Japan holds more than 50% of the market share, followed by China. South Asia is also cited as a highly lucrative investment pocket for manufacturers of industrial electronics packaging solutions, potentially outpacing other regional markets in terms of growth rate. Growth of South and East Asian market is attributed to robust manufacturing of consumer electronics and swelling demand for impact-resistant protective packaging solutions.

Europe is another prominent market for industrial electronics packaging, more than 60% of which is accounted by Germany. The country will continue to spearhead European market owing to towering rate of production of semiconductor components and equipment.

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Europe & the US Account for a Massive Share in Global Production of Industrial Electronics

Manufacturers of industrial electronics packaging are eyeing business expansion across countries with high consumer electronics production, as an effort to strengthen their foothold in the global industrial electronics packaging market. Leading manufacturers of industrial electronics packaging are either based out of the US or Europe, or have a strong presence in these regions, as both markets hold a collective share of more than 60% in the global production of industrial electronics.

Key Segments of Industrial Electronics Packaging Industry Survey

Industrial Electronics Packaging Market by Product Type:

  • Testing & Measuring Equipment
  • Process Control Equipment
  • Industrial Controls
  • Power Electronics
  • Industrial Automation Equipment & Others

Industrial Electronics Packaging Market by Material Type:

  • Plastic Industrial Electronics Packaging
    • PE
    • PET
    • PS
    • PP
    • PVC
  • Paper & Paperboard Industrial Electronics Packaging

Industrial Electronics Packaging Market by Packaging Type:

  • Rigid Industrial Electronics Packaging
    • Corrugated Boxes
    • Containers
    • Protective Packs
    • Trays
    • Clamshells
    • Bin & Totes
    • Others
  • Flexible Industrial Electronics Packaging
    • Bags & Pouches
    • Tapes & Labels
    • Films & Others

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Industrial Electronics Packaging Market by Region:

  • North America Industrial Electronics Packaging Market
  • Latin America Industrial Electronics Packaging Market
  • Europe Industrial Electronics Packaging Market
  • East Asia Industrial Electronics Packaging Market
  • South Asia & Pacific Industrial Electronics Packaging Market
  • Middle East & Africa (MEA) Industrial Electronics Packaging Market

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Future Market Insights, Inc. (ESOMAR certified, Stevie Award – recipient market research organization and a member of Greater New York Chamber of Commerce) provides in-depth insights into governing factors elevating the demand in the market. It discloses opportunities that will favor the market growth in various segments on the basis of Source, Application, Sales Channel and End Use over the next 10 years.

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About the Author

Nikhil Kaitwade

Associate Vice President at Future Market Insights, Inc. has over a decade of experience in market research and business consulting. He has successfully delivered 1500+ client assignments, predominantly in Automotive, Chemicals, Industrial Equipment, Oil & Gas, and Service industries.
His core competency circles around developing research methodology, creating a unique analysis framework, statistical data models for pricing analysis, competition mapping, and market feasibility analysis. His expertise also extends wide and beyond analysis, advising clients on identifying growth potential in established and niche market segments, investment/divestment decisions, and market entry decision-making.
Nikhil holds an MBA degree in Marketing and IT and a Graduate in Mechanical Engineering. Nikhil has authored several publications and quoted in journals like EMS Now, EPR Magazine, and EE Times.

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