The market for semiconductor assembly and testing services market generated around US$ 32.6 billion in revenue in 2021. By 2029, the market for general semiconductor assembly and testing services is anticipated to reach US$ 52.1 billion, growing at a CAGR of 6.1% between 2022 and 2029.
Unending developments and the implementation of new innovations, such as silicon-through interconnection innovation and natural substrate-interposer innovation, are creating enormous revenue opportunities for players in the semiconductor assembly and testing services market.
Executing semiconductor assembly and testing services helps manufacturers produce semiconductors, memory chips, and wafers used in consumer electronics products and mobile/remote handsets more effectively.
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Key Takeaways of Semiconductor Assembly and Testing Services Market Study
- Among the application segment, the consumer electronics segment is expected to witness a high growth rate, owing to rising demand for audio/video equipment, cameras, calculators, and smart homes (home safety equipment & accessories)
- Asia Pacific Excluding Japan is expected to create lucrative growth opportunities for players in the semiconductor assembly and testing services market, attributable to the rapid growth of packaging of semiconductors, and increasing applications of semiconductor assembly methodologies in this region
- Increasing demand for connected devices worldwide including smartphones and tablets having connectivity and multimedia capabilities propels the demand for higher packaging technologies and creates growth opportunities for service providers in the semiconductor assembly and testing services market.
Gains Upheld by Increasing Demand for Improved Connectivity in Consumer Electronics
Higher demand for mobile and connected devices such as tablets and smartphones has bolstered the demand for higher packaging technologies. Also, rising demand for digital video content drives the growth of high-performance and mobile consumer electronics products, such as Wi-Fi chipsets and other semiconductor chips.
For instance, STATS chipPAC (JCET) develops an expanded Wafer Level Chip Scale Package (eWLCSP), which offers improved testing and a low-cost fan-in wafer-level package for space-controlled mobile devices. Moreover, the growth of end-use industries such as electronics and semiconductors, automotive, manufacturing, and packaging is expected to offer potential growth opportunities for manufacturers in the global semiconductor assembly and testing services market.
ODMs and OEMS to Prioritize ‘Fab-lite’ Strategy
As semiconductor process technology migrates to larger wafers and smaller feature sizes, the cost of building state-of-the-art wafer fabrication factories has risen significantly, reaching several billion dollars. High investment costs for next-generation silicon technology and equipment are influencing various semiconductor companies to adopt or maintain a ‘fabless’ or ‘fab-lite’ strategy. The increasing demand for semiconductors is needed for cloud integration and connectivity including sensors, computing, interactivity, and communication devices.
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Competitive Landscape
Many key solution providers are inclined at investing heavily in innovation, research, and development practices to uncover increased applications of semiconductor assembly and testing services. With the use of technology, players are also focusing on lowering the cost of semiconductor assembly and testing services for captivating an increased customer base.
- For instance, in May 2020, UTAC Holdings Ltd and AEM Holdings Ltd entered into a partnership to develop CMOS image sensor test systems and solutions. Under this pairing, both companies will focus on providing cost-effective test system solutions for CMOS image sensor products.
- For instance, in December 2019, the JCET group partnered with Analog Devices to grow its Singapore test business. This collaboration with JCET will allow Analog Devices to take advantage of operational and test engineering expertise.
More Valuable Insights on Semiconductor Assembly and Testing Services Market
FMI’s report on the semiconductor assembly and testing services market is segmented into three major sections such as services (assembly & packaging services (copper wire & gold wire bonding, flip chip, wafer level packaging, TSV, and others), and testing services), applications (communications, computing & networking, consumer electronics, industrial and automotive electronics, and region to help readers understand and lucrative evaluate opportunities in the semiconductor assembly and testing services market.
Semiconductor Assembly and Testing Services Market Outlook by Category
By Services, Semiconductor Assembly and Testing Services Market Demand is segmented as:
- Assembly & Packaging Services
- Copper Wire and Gold Wire Bonding
- Flip Chip
- Wafer Level Packaging
- TSV
- Others
- Testing Services
By Application, Semiconductor Assembly and Testing Services Market Outlook is segmented as:
- Communications
- Computing & Networking
- Consumer Electronics
- Industrial
- Automotive Electronics
By Region, Semiconductor Assembly and Testing Services Market is segmented as:
- North America
- Latin America
- Western Europe
- Eastern Europe
- Asia Pacific Excluding Japan
- Japan
- The Middle East and Africa (MEA)
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Future Market Insights, Inc. (ESOMAR certified, Stevie Award – recipient market research organization, and a member of Greater New York Chamber of Commerce) provides in-depth insights into governing factors elevating the demand in the market. It discloses opportunities that will favor the market growth in various segments on the basis of Source, Application, Sales Channel, and End Use over the next 10 years.
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