In 2023, it is expected that the global panel level packaging market will be worth USD 2.1 billion. By 2033, the market is projected to be worth about USD 8.5 billion. It is anticipated to increase at an astounding rate of 14.9% CAGR from 2023 to 2033.
Manufacturers are pressuring their vendors to produce panel-processing tools and supplies so they may enable them to bring wafer-level precision to packed operations on panel substrates. It is projected that panel level packaging (PLP) would become a crucial packaging method in the next ten years.
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This type of packaging is extensively used to package several components, including baseband, central processing unit (CPU), graphics processing unit (GPU), power management integrated circuit module, and field programmable gate array. The method lowers circuit packaging costs while increasing design flexibility.
Key Takeaways from the Panel Level Packaging Market Study:
- From 2018 to 2022, the panel level packaging market showed a historical CAGR of about 18.6%, which was rather significant.
- By 2033, it is anticipated that the panel level packaging market in the USA will be worth USD 1.4 billion.
- The panel level packaging market in the United Kingdom is projected to surge at a 13.2% CAGR during the forecast period.
- During the assessment period, South Korea is expected to generate an absolute dollar opportunity of around USD 392.7 million.
- The fan-out panel level packaging category is anticipated to increase at a CAGR of 14.8% by 2033, according to integration type.
“There is an increasing need to package numerous electronics components in a tiny area as integrated circuits technology advances. When creating portable, ultra-thin consumer electronics such as smartphones, smart devices, and smart watches, the technology is helpful. These are compact units that use less energy and have a variety of applications,” says Ismail Sutaria, Principal consultant at Future Market Insights
Competitive Landscape
Amkor Technology Inc., Deca Technologies, Lam Research Corporation, ASE Group, Siliconware Precision Industries Co., Ltd., Fraunhofer Institute, SPTS Technologies, Stats ChipPac, Qualcomm Technologies, Samsung, and TSMC are some of the worldwide panel level packaging market’s major companies.
The market is extremely consolidated, thanks to the existence of the aforementioned main players. These companies hold a large share of the market. However, over the next ten years, more enterprises will invest in considerable R&D and market development initiatives in order to produce competitive panel level packaging solutions.
Few of the recent developments in the panel level packaging market are:
- In December 2022, 3DSEMI, a wafer level packaging solutions provider based in Guangdong, China, raised US$ 23.7 million from Zengcheng Industrial Investment, Guangdong Semiconductor and Integrated Circuit Industry Investment Fund, and Guangzhou Industrial Investment Group. The company is a well-known wafer level packaging solutions producer and supplier in China.
- In December 2022, TSMC, a Taiwanese semiconductor manufacturer, announced a US$ 40 billion investment in Arizona-based plants. They also want to develop a second facility in the same area. It will be operational by 2026 and utilized to manufacture sophisticated semiconductors.
- In November 2022, Samsung Electronics announced the development of GDDR6W panel level packaging, which doubles capacity and performance. It employs fan-out wafer-level packaging technology. It offers outstanding performance, bandwidth, and capacity in this dynamic random access memory. The module size is tiny as a result of the fan-out wafer level packing technology. The GDDR6W is capable of creating immersive metaverse experiences with powerful graphics.
Global Panel Level Packaging Market Outlook by Category
By Integration Type:
- Fan-in Panel Level Packaging
- Fan-out Panel Level Packaging
By Carrier Type:
- 200 mm
- 300 mm
- Panel
By End User:
- Consumer Electronics
- IT and Telecommunication
- Industrial
- Aerospace and Defense
- Automotive
- Healthcare
- Others
By Region:
- North America
- Europe
- Asia Pacific
- Latin America
- Middle East & Africa
About Future Market Insights (FMI)
Future Market Insights, Inc. (ESOMAR certified, recipient of the Stevie Award, and a member of the Greater New York Chamber of Commerce) offers profound insights into the driving factors that are boosting demand in the market. FMI stands as the leading global provider of market intelligence, advisory services, consulting, and events for the Packaging, Food and Beverage, Consumer Technology, Healthcare, Industrial, and Chemicals markets. With a vast team of over 400 analysts worldwide, FMI provides global, regional, and local expertise on diverse domains and industry trends across more than 110 countries.
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