The global Electrostatic Discharge (ESD) Packaging Market is projected to experience significant growth over the next decade, according to recent market forecasts. Valued at USD 2.0 billion in 2023, the market is expected to expand to USD 3.3 billion by 2033, registering a steady Compound Annual Growth Rate (CAGR) of 5.1% during the forecast period.
Defense spending in leading countries such as the United States, France, and the United Kingdom, as well as numerous developing countries such as Russia, India, and China, have been steadily expanding. Many of these countries are also involved in the export of weaponry. It leads to continuing research and development investment in the aerospace and defense markets.
Semiconductor devices are used in a variety of military and aerospace equipment, including data processing units, data display systems, computers, and aircraft guidance-control assemblies.
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Several advanced electronic goods are used by naval warships, satellite communication channels on board, armament control systems, coastguards, and other users who require military-grade packaging of electronic and
semiconductor components. Humidity and a hostile climate necessitate the need for high-quality products and facilitate research and development investment.
Global electrostatic discharge packaging comprises the use of materials to safeguard electrostatic discharge-sensitive devices. Electrostatic discharge (ESD) packaging is an important option for storing electronic components including semiconductors and printed circuit boards (PCBs). It also contributes to the safe transit of these technological devices.
ESD qualities concerning packaging include resistance to antistatic charging (turbocharging), charge dissipation, and electric charge shielding. Additionally, ESD packaging technology has applications in industries such as automotive, defense and military, manufacturing, healthcare, and aerospace. The fundamental role of this technology in the automobile sector is to ensure/facilitate safe and secure handling and carriage of high-value electronic parts/components while minimizing transport costs.
Key Points from the Electrostatic Discharge (ESD) Packaging Market
- Globally, rising per capita income is fueling increased demand for luxury items such as high-tech vehicles, IoT-enabled household products, and the adoption of electric vehicles. All these reasons are demanding growth for electrostatic discharge packaging.
- The market size is anticipated to be USD 2.0 billion in 2023.
- The electrostatic discharge (ESD) packaging market is expected to secure a CAGR of 5.1% during the forecast period 2023 to 2033.
- Asia Pacific dominated the electrostatic discharge (ESD) packaging market.
Key Developments in the Electrostatic Discharge (ESD) Packaging Market
- June 2022 – Digimarc Corporation announced a collaboration with Sealed Air, a global pioneer in digital printing and packaging, to deliver product digitization to businesses such as eCommerce fulfillment, industrials, and consumer products on a huge scale using smart packaging.
- March 2022 – Intel announced the first phase of its efforts to invest up to US$ 84 billion in the European Union over the next decade across the semiconductor value chain, from research and development to production to sophisticated packaging technologies.
- July 2022 – Mondi has teamed up with Diamant, a German bike manufacturer, to wrap and protect its branded mountain and trekking bikes. Diamant wraps his bike handlebars in Mondi’s pre-made paper Protection Bags rather than plastic bubble wrap. The innovative method protects motorcycles during shipping while lowering Diamant’s plastic packing by about 85% each year.
- June 2022 – Spadel and DS Smith PLC introduced a new 5-liter packaging designed to be both practical and ecological. The Eco Pack was developed in partnership with global leaders in natural mineral water and sustainable packaging solutions. The octagonal cardboard box contains a flexible plastic bag that holds 5 liters of liquid. Its economical material utilization results in a 65% reduction in plastic while also extending the shelf life of the water.
Some Prominent Companies Include
- Smurfit Kappa Group
- DS Smith plc
- Sealed Air Corporation
- Pregis LLC
- ACHILLES CORPORATION
- DESCO Industries Inc.
- STOROPACK HANS REICHENECKER GMBH
- Nefab Group
- Teknis Limited
- Kiva Containers
- Delphon Industries, LLC
- Elcom Ltd.
- Protective Packaging Corporation
- GWP Group
- Transcendia Inc.
Key Segmentations
By Product Type:
- Bags
- Trays
- Clamshell
- Shrink Films
- Boxes & Containers
- Tapes & Labels
- Foams
- Totes/IBC
- Racks
- Others (Pouches, Sheets, etc.)
By Material & Additive Type:
- Conductive & Dissipative Polymers
- Metal
- Additive
By Application:
- Electrical & Electronic Component
- Equipment
- Explosive Powders
- Drugs
By End-user Base:
- Electrical & Electronics
- Automobile
- Defense & Military
- Aerospace
- Healthcare
- Others
By Region:
- North America
- Latin America
- Europe
- South Asia
- East Asia
- The Middle East & Africa
- Oceania
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Future Market Insights, Inc. (ESOMAR certified, recipient of the Stevie Award, and a member of the Greater New York Chamber of Commerce) offers profound insights into the driving factors that are boosting demand in the market. FMI stands as the leading global provider of market intelligence, advisory services, consulting, and events for the Packaging, Food and Beverage, Consumer Technology, Healthcare, Industrial, and Chemicals markets. With a vast team of over 400 analysts worldwide, FMI provides global, regional, and local expertise on diverse domains and industry trends across more than 110 countries.
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