Blister Packaging Market is Expected to Reach a Strong Valuation of USD 55.1 Billion by 2034 | Future Market Insights, Inc.

Blister Packaging Market

The global blister packaging market is on a strong growth trajectory, with estimated sales valued at USD 29.3 billion in 2024. Revenue is projected to expand at a robust CAGR of 6.5% over the forecast period, reaching a total valuation of USD 55.1 billion by 2034.

In 2023, the global blister packaging market size stood at US$ 27.6 billion, and it is expected to exhibit a year-over-year growth rate of 6.1% in 2024. This growth is primarily driven by the increasing adoption of blister packs across various sectors.

Plastic blister packaging continues to dominate the market due to its versatility and cost-effectiveness. It is anticipated that plastic blister packs will account for 44.5% of the global blister packaging market share by 2034.

Carded blisters, known for their high visibility, are experiencing significant adoption in industries such as healthcare, food and beverage, and cosmetics. According to the latest industry analysis, the carded segment is projected to hold a value share of 55.3% in 2034.

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Blister packs offer key advantages such as convenience, dosage control, and tamper evidence, making them ideal for pharmaceutical packaging. The growing demand for pharmaceuticals, driven by rising chronic disease cases and increased health awareness, is expected to further boost blister packaging sales.

Moreover, the development of smart blister packs is revolutionizing the blister packaging industry. Leading players are integrating novel technologies such as RFID tags and sensors into their products, addressing challenges like medication adherence and enhancing overall packaging functionality.

Key Takeaways:

  • Japan’s blister packaging market is expected to reach a value of USD 2.1 billion by 2034, with a projected growth rate of 6.2% CAGR, driven primarily by increased use in the food sector.
  • Carded blister segment to hold a 55.3% value share in 2034.
  • Smart blister packs incorporating RFID tags and sensors are transforming the industry.

Competitive Landscape

With increased environmental concerns, there is a stronger demand for biodegradable and recycled blister packs. Leading blister packaging manufacturers are focusing on creating innovative products with enhanced functionality.

Several players are experimenting with blister package designs to improve their attractiveness and functionality. They offer bespoke blister packaging solutions to fit their clients’ individual branding and product requirements. Furthermore, corporations use methods such as new product launches, alliances, distribution agreements, acquisitions, and facility expansions to acquire a competitive advantage in the marketplace.

Key Players in the Blister Packaging Market

  • Klockner Pentaplast Group
  • Amcor plc
  • Constantia Flexibles GmbH
  • Honeywell International
  • Sonoco Products Company
  • Tekni-Plex, Inc.
  • Uflex Ltd
  • Rohrer Corporation
  • R-Pharm Germany GmbH

Recent Developments in the Blister Packaging Market

  • In January 2024, TekniPlex Healthcare and Alpek Polyester launched the world’s first pharmaceutical-grade blister film made with 30% post-consumer recycled content. This innovative Octal rDPET™ blister film includes PCR content, enabling pharmaceutical companies to stay ahead of upcoming sustainability legislation that is expected to impact packaging across all industries.
  • In February 2024, PulPac and PA Consulting formed the Blister Pack Collective, and Sanofi Consumer Healthcare joined as a member. This alliance intends to reduce single-use plastic packaging by embracing dry molded fiber technology. This will help reduce the 100,000 tonnes of plastic medication packaging used annually.
  • In June 2020, SEA Vision and Marchesini Group introduced a novel blister T&T technology.

Global Blister Packaging Market Segmentation

By Material Type:

  • Plastic
    • Polyvinyl Chloride (PVC)
    • Polyethylene Terephthalate (PET)
    • Polyethylene (PE)
    • Others
  • Aluminum
  • Paper & Paperboard
  • Others

By Product Type:

  • Clamshell
  • Carded

By Technology Type:

  • Cold Forming Technology
  • Thermoforming Technology

By End-use:

  • Food
  • Pharmaceutical
  • Veterinary & Nutraceutical
  • Medical Devices
  • Electronics & Electricals
  • Industrial Goods
  • Consumer Goods

By Region:

  • North America
  • Latin America
  • East Asia
  • South Asia & Pacific
  • Western Europe
  • Eastern Europe
  • Middle East & Africa

About Future Market Insights (FMI)

Future Market Insights, Inc. (ESOMAR certified, recipient of the Stevie Award, and a member of the Greater New York Chamber of Commerce) offers profound insights into the driving factors that are boosting demand in the market. FMI stands as the leading global provider of market intelligence, advisory services, consulting, and events for the Packaging, Food and Beverage, Consumer Technology, Healthcare, Industrial, and Chemicals markets. With a vast team of over 400 analysts worldwide, FMI provides global, regional, and local expertise on diverse domains and industry trends across more than 110 countries.

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About the Author

Nikhil Kaitwade

Associate Vice President at Future Market Insights, Inc. has over a decade of experience in market research and business consulting. He has successfully delivered 1500+ client assignments, predominantly in Automotive, Chemicals, Industrial Equipment, Oil & Gas, and Service industries.
His core competency circles around developing research methodology, creating a unique analysis framework, statistical data models for pricing analysis, competition mapping, and market feasibility analysis. His expertise also extends wide and beyond analysis, advising clients on identifying growth potential in established and niche market segments, investment/divestment decisions, and market entry decision-making.
Nikhil holds an MBA degree in Marketing and IT and a Graduate in Mechanical Engineering. Nikhil has authored several publications and quoted in journals like EMS Now, EPR Magazine, and EE Times.

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