As per the FMI survey, the net valuation of the market grew from USD 0.8 billion in 2018 to USD 1.4 billion in 2022. This suggests that between 2018 and 2022, the substrate-like PCB market developed at a considerable pace of 15.6% annually.
According to the recently released report by FMI, the total worth of all substrate-like PCBs sold globally in 2023 could be USD 1.6 billion. The expected growth of the substrate-like printed circuit board (PCB) market is going to be around 13.5% from 2023 to 2033. The net valuation of the global market is projected to reach up to USD 5.7 billion by the end of the year 2033.
Growing demand for PCBs with enhanced electrical and thermal performance in consumer electronics, automotive, telecommunications, and aerospace sectors are met by substrate-like PCBs. In addition to this, compared to conventional printed circuit boards, substrate-like PCBs have interconnections per unit area, great signal integrity, and superior reliability.
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Substrate-like PCBs are suited for applications that need high-speed data transmission, miniaturization so could gain traction as industries push for sophisticated and small electronic gadgets. In addition to this, their advantages in terms of durability, vibration resistance, and space reductions frequently exceed the cost issues.
Key Takeaways from the Substrate-like PCB Market Study Report
- Positive market prospects for the foreseeable future are suggested by the United States substrate-like PCB market is predicted to increase with a 12.3% CAGR through 2033.
- The sales of the substrate-like PCB market in the United Kingdom could be USD 142.6 million by 2033, according to the information available.
- China could develop at a compound annual growth rate (CAGR) of 15.1% from 2023 to 2023, reaching a market size of USD 1.5 billion.
- Japan and South Korea are other two notable countries in Asia Pacific that are offering the substrate-like PCB industry significant room for expansion. During the forecast years, these two regional markets are anticipated to register 13.8% and 14% CAGRs respectively.
- The automated optical inspection technology segment is anticipated to expand in the projected years at a roughly 13.3% CAGR.
Competitive Landscape for the Substrate-like PCB Market Players
Global players are increasing their geographic presence in Southeast Asia by opening sizable PCB facilities in the countries of Southeast Asia. By strategically moving production sites close to its clients and important markets new players are scaling up their business to compete with existing players.
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Key Players Profiled in the Substrate-like PCB Market Report
- Kinsus Interconnect Technology
- Ibiden Co., Ltd.
- Compeq Manufacturing Co., Ltd.
- Unimicron Technology Corporation
- Austria Technologies & Systemtechnik AG (AT&S)
- TTM Technologies
- Samsung Electro-Mechanics
- Korea International Circuit Incorporation
- Zhen Ding Technology
- Daeduck Gds Company
- Tripod Technology Corp
Recent Developments by the Substrate-like PCB Manufacturing Industries
- A USA-based firm named TTM Technologies Incorporated (TTM) announced its intention to build a brand-new manufacturing plant in Penang, Malaysia, in May 2022. It intends to finish the investment by 2025, with capital investment for this highly automated PCB initiative could be US$ 130 million.
- Simmtech, a company in South Korea stated in January 2022 that its first sizable PCB facility in Batu Kawan Industrial Park, Malaysia, was almost finished. This new facility which produces PCBs and packaging substrates for semiconductors increases its production capacity and joins its other facilities in Southeast Asia. Dynamic random-access memory (DRAM) and NAND memory chip packaging substrates are the company’s primary focus in this new production facility.
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Key Segments Covered by Substrate-like PCB Industry Survey Report
Substrate-like PCB Industry Segmentation by Line or Space Type:
- Less than 25/25 µm
- 25/25 µm and 30/30 µm
Substrate-like PCB Industry Segmentation by Inspection Technology:
- Automated Optical Inspection
- Direct Imaging or Laser Direct Imaging
- Automated Optical Shaping
Substrate-like PCB Industry Segmentation by Application:
- Consumer Electronics Industries
- Computing and Communications Sector
- Automotive Industries
- Medical Sector
- Manufacturing Industries
- Military, Defense, and Aerospace Sector
- Other Applications
Substrate-like PCB Industry Segmentation by Region:
- North America Market
- Latin America Market
- Europe Market
- East Asia Market
- South Asia and Pacific Market
- The Middle East and Africa (MEA) Market
About Future Market Insights (FMI)
Future Market Insights, Inc. (ESOMAR certified, recipient of the Stevie Award, and a member of the Greater New York Chamber of Commerce) offers profound insights into the driving factors that are boosting demand in the market. FMI stands as the leading global provider of market intelligence, advisory services, consulting, and events for the Packaging, Food and Beverage, Consumer Technology, Healthcare, Industrial, and Chemicals markets. With a vast team of over 400 analysts worldwide, FMI provides global, regional, and local expertise on diverse domains and industry trends across more than 110 countries.
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