The global non-UV dicing tapes market is anticipated to reach a valuation of US$ 1.59 billion in 2023, driven by growing demand for consumer electronics. The trend is expected to create new opportunities for the market, leading to a projected CAGR of 6.0% between 2023 and 2033, and reaching a total valuation of approximately US$ 2.8 billion by 2033.
One of the major factors contributing to the growth of the non-UV dicing tapes market is the expanding automotive electronics market. The automotive industry is undergoing a transformative shift toward electric and autonomous vehicles, amplifying the need for cutting-edge semiconductor technology. Non-UV dicing tapes are integral to this transformation, ensuring the accurate dicing of chips used in various automotive applications, including advanced driver assistance systems (ADAS), infotainment, and electric powertrains. The surge in demand for electric vehicles and smart automotive technologies directly translates into an increased requirement for non-UV dicing tapes.
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Semiconductor manufacturers are seeking environmentally responsible solutions, as industries across the board embrace sustainability. Non-UV dicing tapes align with this trend, offering reduced particle generation and residue-free removal, minimizing waste and contamination during the dicing process. The adoption of non-UV dicing tapes gains momentum, as sustainability becomes an imperative.
The pace of technological innovation in the semiconductor industry is relentless, with new materials, designs, and processes constantly being developed. Non-UV dicing tapes evolve in tandem with these advancements, adapting to the changing landscape and ensuring compatibility with cutting-edge semiconductor manufacturing techniques.
Key Takeaways from the Market Study
- Global non-UV dicing tapes market was valued at US$ 1.5 billion by 2022-end.
- From 2018 to 2022, the market demand expanded at a CAGR of 3.0%.
- Asia Pacific is expected to expand at a dominant CAGR of 5.9 % during the forecast period.
- By material type, polyethylene terephthalate (PET) segment is expected to constitute a CAGR of 5.9% in 2033.
- On the basis of application, wafer dicing segment is expected to dominate the market with a CAGR of 5.9% in 2033.
- From 2023 to 2033, non-UV dicing tapes market is expected to flourish at a CAGR of 6.0%.
- By 2033, the market value of non-UV dicing tapes is expected to reach US$ 2.8 billion.
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Semiconductor market growth, across the globe, is a major factor that is expected to propel the growth of the non-UV dicing tapes market in the near future, remarks an FMI analyst.
Competitive Landscape
Prominent players in the non-UV dicing tapes market are Pantech Tape Co. Ltd., Mitsui Chemicals Inc., AI Technology, Inc., Furukawa Electric Co. Ltd., LINTEC Corporation, QES GROUP BERHAD, MTI Co. Ltd., Han Kook Tapes Sdn Bhd, NIITO DENKO CORPORATION, Schenzhen Xinst Technology Co. Ltd., among others.
Recent Developments:
- In 2023, Nitto Denko Corporation developed a new technology for the production of non-UV dicing tapes that is more energy-efficient and environmentally friendly.
- In 2022, Avery Dennison Corporation acquired Micropore Technologies, a leading manufacturer of non-UV dicing tapes.
- In 2021, 3M Company launched its new line of non-UV dicing tapes for the automotive industry.
- In the same year, Panacol-Elosol GmbH expanded its production capacity for non-UV dicing tapes in Germany.
More Valuable Insights Available
Future Market Insights offers an unbiased analysis of the global non-UV dicing tapes market, providing historical data for 2018 to 2022 and forecast statistics from 2023 to 2033.
To understand opportunities in the non-UV dicing tapes market, the market is segmented on the basis of material type (PVC, PET, PO, and Others (EVA, etc.)), by thickness (85-125 micron, 126-150 micron, below 85 micron, and above 150 micron), by coating type (single sided, and double sided), and by application (wafer dicing, package dicing, and others (glass, ceramics)), across seven major regions (North America, Latin America, Western Europe, Eastern Europe, South Asia & Pacific, East Asia, and Middle East & Africa (MEA)).
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