A power integrated modules market is a physical containment for various power components, mostly power semiconductor devices. These power semiconductors are usually sintered or soldered on a power electronic substrate. The global power integrated modules market is forecasted to be appraised at US$ 5,774 Million by 2032, up from US$ 1,765 Million in 2022, advancing at a CAGR of 12.6% during the forecast period.
The increase in demand for energy requirement is the major factor driving the growth of the market. Also, the demand for consumer products such as washing machine, refrigerators, and others are increasing at a rapid pace globally, thus anticipated to boost the global power integrated market during the forecast period.
The increase in application for power-integrated modules is the key factor attributing the growth of the market. Power-integrated modules are used in laptops, tablets, therefore increase in demand for laptops and tablets for B2C and the B2B market is expected to drive the power-integrated market in forthcoming years.
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Regional Trend:
Asia Pacific is expected to dominate the power-integrated modules market, owing to the surge in demand for consumer goods such as refrigerators, air conditioners, and washing machines. Also, Asia Pacific countries such as China and India are witnessing an increase in energy requirements, which is the other reason propelling the growth of the power integrated module market.
Economic production and government initiatives for manufacturing sectors such as Make in India, are the major factors driving the growth of the manufacturing sector, which is making the Asia Pacific region emerge as a strong manufacturing hub.
In addition to the above, a robust manufacturing hub in Asia Pacific region coupled with a wide presence of major players for manufacturing consumer goods are boosting the growth of the power integrated module market during the forecast period.
Leading Key Players:
The major player operating in the power integrated modules market includes Future Electronics, Mitsubishi Electric Corp., ON Semiconductor Corporation, Fuji Electric Co., Ltd., Infineon Technologies AG., VPT, Inc., Applied Power Systems, Inc., Lectron Industries, COSEL ASIA LTD., STMicroelectronics N.V., Renesas Electronics Corporation, Texas Instruments Inc., Sensitron Semiconductor, Sanken Electric, ROHM Semiconductor, Hirata Corporation, Schneider Electric Co. Ltd., Robert Bosch GmbH, Continental AG., NXP Semiconductors, Toshiba Corporation, Powerex Inc., Microchip Technology Inc., SEMIKRON Elektronik GmbH & Co. KG, etc.
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Key Segments
By Type:
- Output Power
- Output Current
- Output/Input Voltage
- Packaging Type
- Dimensions
By Device:
- IGBT
- MOSFET
By Application:
- Embedded Computing
- Controllers
- Processors
- SAN/NAS Accelerator
- Appliance
- Network Processors
- Noise Sensitive Applications
By Region:
- North America
- Latin America
- Middle East and Africa
- Asia Pacific
- Europe
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