The Quad-Flat-No-Lead Packaging Market, valued at approximately US$ 62 billion, is on an upward trajectory projected to exceed a staggering US$ 235 billion by the end of 2027. This remarkable growth is anticipated during the forecast period of 2017-2027, driven by a substantial compound annual growth rate (CAGR) of 13.1%.
The thriving global Quad-Flat-No-Lead Packaging Market is poised for substantial expansion, fueled by various factors shaping its landscape.
Get a Sample Copy of Report:
https://www.futuremarketinsights.com/reports/sample/rep-gb-2039
Global Quad-Flat-No-Lead Packaging Market: Factors Influencing Growth
Factors such as rising demand for wireless applications, growing adoption of portable devices, small form factor, enhanced thermal performance, rising applications in the automobile sector, high electrical performance and increased reliability are boosting adoption and consequently the growth in revenue of the global quad-flat-no-lead packaging market. However, aspects such as changing price of raw materials, more space needed by QFN packaging, wirebond challenge, high competition with WLCSP and BGA, high cost and problems associated with assembling the QFN package are hindering the growth of the global market.
Global Quad-Flat-No-Lead Packaging Market: Segmental Snapshot
The global quad-flat-no-lead packaging market is segmented on the basis of type, QFN variants, application and by region.
- By type, the plastic moulded QFNs segment is expected to reflect high market attractiveness and is the largest segment. The plastic moulded QFNs segment is estimated to reach a value higher than US$ 180 Bn by the end of the year of forecast thus dominating the global market. Air-cavity QFNs segment is projected to grow at a higher pace in the coming years.
- By QFN variant, the quad-flat-no-lead segment is anticipated to reach a noteworthy valuation by the end of the assessment period. The ultrathin quad-flat-no-lead segment is projected to grow at the fastest rate to register a CAGR of 14.4% throughout the period of assessment.
- By application, the radio frequency devices segment is estimated to be valued at around US$ 26 Bn in 2017 and is likely to lead the global market. The wearable devices segment is projected to register the fastest growth rate of 0% owing to increased use of quad-flat-no-lead packaging in wearable devices.
- By region, Asia Pacific excluding Japan reflects high growth potential. The quad-flat-no-lead packaging market in Asia Pacific excluding Japan is projected to grow at the highest rate and is estimated to be the largest among all other regional markets, thus dominating the global market.
Request for Methodology:
https://www.futuremarketinsights.com/request-report-methodology/rep-gb-2039
Global Quad-Flat-No-Lead Packaging Market: Forecast Highlights
The global quad-flat-no-lead packaging market is anticipated to reach a value higher than US$ 235 Bn by the end of the year of assessment from a valuation of more than US$ 68 Bn in 2017. The global market for quad-flat-no-lead packaging is projected to grow at a stellar CAGR of 13.1% throughout the period of forecast.
Global Quad-Flat-No-Lead Packaging Market: Competitive Assessment
The research report on the global market for quad-flat-no-lead packaging includes analysis on key players and presents vendor insights in a dedicated chapter. Intelligence on key players such as NXP Semiconductor, Fujitsu Ltd., Toshiba Corporation, Texas Instruments, Microchip Technology Inc., STATS ChipPAC Pte. Ltd., ASE Group, Amkor Technology, UTAC Group, Linear Technology Corporation, Henkel AG & Co., and Broadcom Limited has been included in this chapter.
Market Segmentation
By Type
- Air-Cavity QFNs
- Plastic-moulded QFNs
By QFN Variants
- Very thin quad flat no-lead (VQFN)
- Ultrathin quad flat no-lead (UQFN)
- Quad flat no-lead (QFN)
- Others
By Applications
- Radio Frequency Devices
- Wearable Devices
- Portable Devices
- Others
By Region
- North America
- Latin America
- Western Europe
- Eastern Europe
- APEJ
- Japan
- MEA
Request for Customization:
https://www.futuremarketinsights.com/customization-available/rep-gb-2039
Author:
Sudip Saha is the managing director and co-founder at Future Market Insights, an award-winning market research and consulting firm. Sudip is committed to shaping the market research industry with credible solutions and constantly makes a buzz in the media with his thought leadership. His vast experience in market research and project management a consumer electronics will likely remain the leading end-use sector cross verticals in APAC, EMEA, and the Americas reflects his growth-oriented approach to clients.
He is a strong believer and proponent of innovation-based solutions, emphasizing customized solutions to meet one client’s requirements at a time. His foresightedness and visionary approach recently got him recognized as the ‘Global Icon in Business Consulting’ at the ET Inspiring Leaders Awards 2022.
About Future Market Insights (FMI)
Future Market Insights, Inc. (ESOMAR certified, recipient of the Stevie Award, and a member of the Greater New York Chamber of Commerce) offers profound insights into the driving factors that are boosting demand in the market. FMI stands as the leading global provider of market intelligence, advisory services, consulting, and events for the Packaging, Food and Beverage, Consumer Technology, Healthcare, Industrial, and Chemicals markets. With a vast team of over 400 analysts worldwide, FMI provides global, regional, and local expertise on diverse domains and industry trends across more than 110 countries.
Contact Us:
Future Market Insights Inc.
Christiana Corporate, 200 Continental Drive,
Suite 401, Newark, Delaware – 19713, USA
T: +1-845-579-5705
For Sales Enquiries: sales@futuremarketinsights.com
Website: https://www.futuremarketinsights.com
LinkedIn| Twitter| Blogs | YouTube
