As per FMI, the global high-end performance packaging market size reached US$ 3.3 billion in 2022. Global high-end performance packaging demand will rise at 15.9% CAGR between 2023 and 2033.
The high-end performance packaging market value is forecast to reach US$ 17.0 billion by 2033. UHD FO technology type will dominate the market during the assessment period. FMI predicts the UHD FO segment to expand at 15.8% CAGR.
Growing demand for advanced packaging technologies is driving the high-end performance packaging market. Rising trend of miniaturization will boost sales through 2033.
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Increasing adoption of high-performance computing (HPC) will propel high-end performance packaging demand. Further, rising popularity of autonomous vehicles will create growth prospects for the market.
Different high-end performance packaging technologies are being used to design ultra-thin devices. These technologies include Ultra High-Density Fan Out (UHD FO), HBM, etc.
The UHD FO packaging is used in advanced technologies such as 5G, cloud computing, and ADAS. High Bandwidth Memory (HBM) has application in bandwidths above 256 GBps. It reduces power consumption of the circuitry.
Si Interposer finds application in heterogeneous packaging techniques. Foveros by Intel provides 3D stacking solutions that make packaging more efficient. It is designed to incorporate two or more chiplets assembled together.
EMIB and Co-EMIB are used in the high-performance computing applications. They make the whole electronics circuit consume less power and function at a higher pace.
Hence, growing usage of these high-end performance packaging technologies will boost the market.
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Key Takeaways from High-End Performance Packaging Market Report:
- The market for high-end performance packaging is set to reach a massive valuation of US$ 17.0 billion by 2033.
- Global high-end performance packaging demand is set to increase at 15.9% CAGR through 2033.
- By technology, UHD FO segment will expand at 15.8% CAGR during the forecast period.
- Based on application, high performance computing segment will accelerate at 15.7% CAGR.
- The United States high-end performance packaging market will exhibit a CAGR of 15.2%.
- Sales of high-end performance packaging across China will surge at 17.4% CAGR through 2033.
- Japan’s high-end performance packaging market will reach US$ 2.7 billion by 2033.
“Surging applications in high-performance computing and autonomous vehicles will continue to boost the global high-end performance packaging market”, says a lead Future Market Insights analyst.
Who is Winning?
Leading players operating in the high-end performance packaging market are developing advanced packaging solutions to meet end user demand from several industries. Besides this, they are adopting strategies such as partnerships, collaborations, acquisitions, and mergers.
Key high-end performance packaging companies include Intel, TSMC, ASE, Samsung, Amkor, JCET Group, Tongfu, ADI, AMD, and ARM. These leading high-end performance packaging manufacturers are developing advanced packaging solutions.
For instance,
- In February 2022, Intel Corporation, the United States-based Technology Company announced that it has signed a definitive agreement in order to acquire the Tower Semiconductor.
Get More Insights into High-End Performance Packaging Market
Future Market Insights, in its new offering, presents an unbiased analysis of the High-End Performance Packaging market, presenting historical market data (2018 to 2022) and forecast statistics for the period of 2023 to 2033.
The study reveals extensive growth in High-End Performance Packaging based on technology (UHD FO, HBM, 3DS, Foveros , 3DNAND, Co-EMIB, EMIB, Si interposer, 3D SoC) and application (data center networking, high-performance computing and autonomous vehicles) across several regions.
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Global High-End Performance Packaging Market Segmentation
By Technology:
- UHD FO
- HBM
- 3DS
- Foveros
- 3DNAND
- Co-EMIB
- EMIB
- Si interposer
- 3D SOC
By Application:
- Data Center Networking
- High Performance Computing
- Autonomous Vehicles
By Region:
- North America
- Europe
- Asia Pacific
- Latin America
- Middle East & Africa
Author:
Sudip Saha is the managing director and co-founder at Future Market Insights, an award-winning market research and consulting firm. Sudip is committed to shaping the market research industry with credible solutions and constantly makes a buzz in the media with his thought leadership. His vast experience in market research and project management a consumer electronics will likely remain the leading end-use sector cross verticals in APAC, EMEA, and the Americas reflects his growth-oriented approach to clients.
He is a strong believer and proponent of innovation-based solutions, emphasizing customized solutions to meet one client’s requirements at a time. His foresightedness and visionary approach recently got him recognized as the ‘Global Icon in Business Consulting’ at the ET Inspiring Leaders Awards 2022.
About Future Market Insights (FMI)
Future Market Insights, Inc. (ESOMAR certified, recipient of the Stevie Award, and a member of the Greater New York Chamber of Commerce) offers profound insights into the driving factors that are boosting demand in the market. FMI stands as the leading global provider of market intelligence, advisory services, consulting, and events for the Packaging, Food and Beverage, Consumer Technology, Healthcare, Industrial, and Chemicals markets. With a vast team of over 5000 analysts worldwide, FMI provides global, regional, and local expertise on diverse domains and industry trends across more than 110 countries.
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