In 2023, it is expected that the global Panel Level Packaging Market will be worth US$ 2.1 billion. By 2033, the market is projected to be worth about US$ 8.5 billion. It is anticipated to increase at an astounding rate of 14.9% CAGR from 2023 to 2033.
Manufacturers are actively urging their suppliers to provide panel-processing equipment and materials, allowing them to achieve wafer-level precision in their packaging operations on panel substrates. The rise of panel level packaging (PLP) is poised to emerge as a pivotal and indispensable packaging technique.
Field-programmable gate arrays (FPGA), central processing units, graphics processing units, power management integrated circuit modules, basebands, and various other electronic components are harnessed through this packaging approach. This method not only enhances design flexibility but also serves to reduce the overall expenses associated with circuit packaging.
This type of packaging is extensively used to package several components, including baseband, central processing unit (CPU), graphics processing unit (GPU), power management integrated circuit module, and field programmable gate array. The method lowers circuit packaging costs while increasing design flexibility.
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Top Trends Fueling Panel Level Packaging Demand Worldwide
Within the Internet of Things (IoT) landscape, small electronic modules housing substantial electronic components are pivotal in performing a multitude of tasks while conserving power. Fan-out wafer level packaging technology has emerged as a prominent choice for many IoT devices, ensuring efficient packaging and enhanced performance.
With the continual advancement of integrated circuits technology, there’s a growing demand to efficiently package a multitude of electronic components within limited space. The approach that allows for packaging multiple components on the same substrate is commonly known as panel level packaging technology.
This innovative technology finds its practical application in the realm of consumer electronics, particularly in the development of ultra-slim, portable devices like smartphones, smart gadgets, and smartwatches. These compact packages boast versatile functionality and exhibit energy-efficient characteristics.
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Key Takeaways from the Panel Level Packaging Market Study:
1. From 2018 to 2022, the Panel Level Packaging Market showed a historical CAGR of about 6%, which was rather significant.
2. By 2033, it is anticipated that the Panel Level Packaging Market in the USA will be worth US$ 1.4 billion.
3. The Panel Level Packaging Market in the United Kingdom is projected to surge at a 2% CAGR during the forecast period.
4. During the assessment period, South Korea is expected to generate an absolute dollar opportunity of around US$ 392.7 million.
5. The fan-out panel level packaging category is anticipated to increase at a CAGR of 8% by 2033, according to integration type.
Key Players
- Amkor Technology Inc.
- Deca Technologies
- Lam Research Corporation
- ASE Group
- Siliconware Precision Industries Co. Ltd.
- Fraunhofer Institute
- SPTS Technologies
- Stats ChipPac
- Qualcomm Technologies
- Samsung
- TSMC
For instance,
LB Semicon, an OSAT firm with its headquarters in South Korea, said in June 2022 that starting the following year, it will provide fan-out wafer level packaging solutions. This action aims to lessen the company’s reliance on the display driver integrated circuit dumping industry. The business provides testing services for application processors and complementary metal-oxide semiconductor image sensors.
The first electronic computer-aided design (ECAD) platform for 3D system design was released in October 2021 by a California-based company called Cadence. Building 3D stacked designs is anticipated to be done using the Cadence 3D-IC platform. This platform supports a variety of packaging arrangements, including 3D stacking, wafer-on-chip packaging, and fan-out wafer level packaging.
Samsung Electronics, a South Korea-based electronics maker, said in May 2021 that it would invest US$ 139.2 billion through 2030 on new manufacturing facilities, foundry operations, and system very large scale integration. The company’s foundry division will support cutting-edge technologies including high performance computing, 5G, and artificial intelligence.
Global Panel Level Packaging Market Outlook by Category
By Integration Type:
- Fan-in Panel Level Packaging
- Fan-out Panel Level Packaging
By Carrier Type:
- 200 mm
- 300 mm
- Panel
By End User:
- Consumer Electronics
- IT and Telecommunication
- Industrial
- Aerospace and Defense
- Automotive
- Healthcare
- Others
By Region:
- North America
- Europe
- Asia Pacific
- Latin America
- Middle East & Africa
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Future Market Insights, Inc. (ESOMAR certified, recipient of the Stevie Award, and a member of the Greater New York Chamber of Commerce) offers profound insights into the driving factors that are boosting demand in the market. FMI stands as the leading global provider of market intelligence, advisory services, consulting, and events for the Packaging, Food and Beverage, Consumer, Technology, Healthcare, Industrial, and Chemicals markets. With a vast team of over 5000 analysts worldwide, FMI provides global, regional, and local expertise on diverse domains and industry trends across more than 110 countries.
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