The non-UV dicing tapes market is experiencing significant growth as the semiconductor industry seeks advanced solutions for dicing and singulation processes. Non-UV dicing tapes are specialized adhesive tapes used to secure semiconductor wafers during dicing, providing stability and protection while allowing precise cutting and separation of individual chips.
In 2032, the Non-UV Dicing Tapes Market is projected to be worth US$2.13 billion. Future demand for the non-UV dicing tapes market is growing due to increased demand in the semiconductor manufacturing sector. According to FMI, the non-UV dicing tapes market was valued at US$ 1.59 billion in 2022 and is anticipated to increase at a CAGR of 6% from 2022 to 2032.
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Key points about the non-UV dicing tapes market:
- Enhanced Yield and Quality: Non-UV dicing tapes offer superior adhesion and stability, minimizing wafer breakage and improving yield rates during the dicing process, ultimately leading to higher-quality chips.
- High-Temperature Resistance: These tapes are designed to withstand the high temperatures generated during dicing, ensuring reliable performance and avoiding tape residue or damage to the wafer surface.
- Minimal Residue and Clean Removal: Non-UV dicing tapes leave minimal residue on the wafer after removal, reducing the need for additional cleaning processes and enhancing overall production efficiency.
- Compatibility with Advanced Materials: The market provides non-UV dicing tapes that are compatible with various advanced semiconductor materials, such as silicon carbide (SiC) and gallium nitride (GaN), meeting the evolving needs of the industry.
- Customization Options: Non-UV dicing tapes can be customized to different wafer sizes and thicknesses, ensuring precise and secure bonding during the dicing process.
- Environmental Considerations: Many non-UV dicing tapes are designed with eco-friendly materials and processes, aligning with the industry’s focus on sustainability and reducing environmental impact.
In conclusion, the non-UV dicing tapes market offers advanced solutions for semiconductor manufacturing processes. With their ability to enhance yield and quality, high-temperature resistance, clean removal, and compatibility with advanced materials, non-UV dicing tapes play a crucial role in ensuring precise and efficient dicing and singulation of semiconductor wafers. As the semiconductor industry continues to evolve, the demand for high-performance non-UV dicing tapes is expected to rise, contributing to the advancement of semiconductor manufacturing processes.
Non-UV dicing tapes are used for large die sizes in the electronics industry. It is made up of flexible films, which is commonly made up of PVC material. The majority of the dicing tape manufacturers have a strong presence in China, Taiwan, and Japan. However, the manufacturers of dicing tapes are expanding their global reach in other regions of Europe and the Americas due to the developed manufacturing industry.
The non-UV dicing tapes are used for wafer back grinding, applicable in the process of gaining considerable momentum across the wafer fabrication industry. Thin wafers contribute significantly to producing energy-efficient end devices without incurring higher switching costs.
Thus it causes increased demand for non-uv dicing tapes during the forecast period. The escalating demand for high-performance flexible circuits from end-users has influenced the demand for PCB, ICs, and other electronic components. Therefore the need for non-UV dicing tapes is expected to increase simultaneously.
The non-UV dicing tapes are available in transparent as well as in a blue colour. Where transparent non-UV dicing tapes are used for low-intensity work of semiconductor and blue non-UV dicing tapes are used for high-intensity dicing for semiconductors.
Non-UV Dicing Tapes Market: Dynamics
The demand for non-UV dicing tapes primarily influenced by the increased demand for the semiconductor manufacturing industry. Non-UV dicing tapes are increasingly gaining preference among semiconductor manufacturers due to the easy removal of chips from wafers after the dicing process.
The decrease in size chips or ICS in electronic devices is reduced due to technological advancements. Hence, it is driving the non-UV dicing tapes market among IC manufacturers. The demand for non-UV dicing tapes is expected to be escalated by the increasing electronic durable gadgets during the forecast period.
PET is the most commonly used material for the manufacturing of non-UV dicing tapes, owing to its advantages such as light in weight, stability, good barrier protection, and high-pressure resistance offered by PET material. Non-UV dicing tapes commonly used in wafer dicing applications.
The manufacturers are reducing the thickness of the wafer due to technological advancement and the growing demand for aesthetically thin electronic products. Thus it results in increased demand for non-UV dicing tapes during the forecast period. The increase in demand for electrical and electronic devices is expected to create an opportunity for the manufacturers of non-UV dicing tapes in the coming years.
It is due to an increase in demand for products such as computers and electrical appliances. Thus it has boosted the demand for PCBs and semiconductors. Therefore the market is expected to witness a positive outlook towards non-UV dicing tapes over the forecast period.
Non-UV Dicing Tapes Market: Regional Outlook
The Asia Pacific region represents remunerative growth opportunities for non-UV dicing tapes market during the forecast period. It is due to the rise in the consumption of compact semiconductors that generate demand for dicing tapes. There is an increased demand for non-UV dicing tapes in developing countries such as India, Brazil, etc.
Established packaging manufacturers are increasingly planning to set-up their manufacturing base in these countries. In addition, emerging economies import electronic components such as semiconductors and PCBs for the production of electronic devices.
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Recent Development in Global Non-UV Dicing Tapes Market
- In March 2017, the company set up QES Technology Phillippines Inc. in Manila. It increases the capacity of the company, and increase the supply of non-UV dicing tapes market in Manila.
Non-UV Dicing Tapes Market: Key Players
Some of the leading players operating in the non-UV dicing tapes market are as follows :
- Pantech Tape Co. Ltd.
- Furukawa Electric Co. Ltd.
- Mitsui Chemicals Inc.
- AI Technology, Inc.
- LINTEC Corporation
- Pantech Tape Co. Ltd
- QES GROUP BERHAD
The report is a compilation of first-hand information, qualitative and quantitative assessment by industry analysts, inputs from industry experts, and industry participants across the value chain. The report provides in-depth analysis of parent market trends, macroeconomic indicators and governing factors along with market attractiveness as per segments. The report also maps the qualitative impact of various market factors on market segments and geographies.
Regional analysis includes
- North America
- Latin America
- Europe
- Middle East and Africa (MEA)
- East Asia
- South Asia
- Oceania
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Non-UV Dicing Tapes Market: Segmentation
By Material Type:
- PVC
- PET
- PO
- Others (EVA, etc.)
By Thickness:
- 85-125 Micron
- 126-150 Micron
- Below 85 Micron
- Above 150 Micron
By Coating Type:
- Single Sided
- Double Sided
By Application:
- Wafer Dicing
- Package Dicing
- Others (Glass, Ceramics)
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