The market for semiconductor assembly and testing services generated $32.6 billion in revenue in 2021. It is anticipated that the market for semiconductor assembly and testing services will reach US$ 52.1 billion by 2029, expanding at a CAGR of 6.1% from 2022 to 2029.
The process of creating integrated circuits (ICs) by mounting and connecting various semiconductor components (transistors, diodes, etc.) onto a substrate and testing the finished IC to make sure it complies with standards is known as semiconductor assembly and testing services (SATS). It usually entails a number of phases, including the production of the wafer, the preparation of the die, the assembling, the packaging, the testing, and the final inspection.
The market for semiconductor assembly and testing services will keep growing quickly due to the rising demand for memory chips and semiconductor wafers across numerous industries. The rapid development of 3D semiconductor assembly, the rise of sophisticated RF modules using system-in-package technology, and the surge in demand for semiconductor devices like microcontrollers and sensors. Nearly 10% of the worldwide semiconductor market is devoted to semiconductor assembly and testing services.
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Competitive Landscape
Many key solution providers are inclined at investing heavily in innovation, research, and development practices to uncover increased applications of semiconductor assembly and testing services. With the use of technology, players are also focusing on lowering the cost of semiconductor assembly and testing services for captivating an increased customer base.
- For instance, in May 2020, UTAC Holdings Ltd and AEM Holdings Ltd entered into a partnership to develop CMOS image sensor test systems and solutions. Under this pairing, both companies will focus on providing cost-effective test system solutions for CMOS image sensor products.
Key Companies Profiled
- ASE Group, Inc.
- Amkor Technology, Inc.
- Siliconware Precision Industries Co., Ltd.
- Powertech Technology, Inc.
- United Test and Assembly Center Ltd.
- JCET Group Co Ltd
- ChipMOS Technologies
- Jiangsu Changjiang Electronics Technology Co., Ltd.
- Chipbond Technology Corporation
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Semiconductor Assembly and Testing Services Market Outlook by Category
By Services, Semiconductor Assembly and Testing Services Market Demand is segmented as:
- Assembly & Packaging Services
- Copper Wire and Gold Wire Bonding
- Flip Chip
- Wafer Level Packaging
- TSV
- Others
- Testing Services
By Application, Semiconductor Assembly and Testing Services Market Outlook is segmented as:
- Communications
- Computing & Networking
- Consumer Electronics
- Industrial
- Automotive Electronics
By Region, Semiconductor Assembly and Testing Services Market is segmented as:
- North America
- Latin America
- Western Europe
- Eastern Europe
- Asia Pacific Excluding Japan
- Japan
- Middle East and Africa (MEA)
Table of Content
1. Executive Summary
1.1. Global Market Outlook
1.2. Demand Side Trends
1.3. Supply Side Trends
1.4. Analysis and Recommendations
2. Market Overview
2.1. Market Coverage / Taxonomy
2.2. Market Definition / Scope / Limitations
3. Key Market Trends
3.1. Key Trends Impacting the Market
3.2. Product Innovation / Development Trends
4. Key Success Factors
4.1. Product Adoption / Usage Analysis
4.2. Product USPs / Features
4.3. Strategic Promotional Strategies
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