Semiconductor Assembly And Testing Services is projected to reach ~US$ 52.1 Bn by 2029

The market for semiconductor assembly and testing services generated $32.6 billion in revenue in 2021. It is anticipated that the market for semiconductor assembly and testing services will reach US$ 52.1 billion by 2029, expanding at a CAGR of 6.1% from 2022 to 2029.Due to the increasing demand for memory chips and semiconductor wafers across a variety of industries, the semiconductor assembly and testing services market will continue to expand at an accelerated rate.

This market is expanding as a result of factors like the rapid development of 3D semiconductor assemblies, the rise of advanced RF modules using system-in-package technology, and the surge in demand for semiconductor devices like microcontrollers and sensors. Nearly 10% of the global semiconductor market is devoted to semiconductor assembly and testing services.

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Competitive Landscape

Many key solution providers are inclined at investing heavily in innovation, research, and development practices to uncover increased applications of semiconductor assembly and testing services. With the use of technology, players are also focusing on lowering the cost of semiconductor assembly and testing services for captivating an increased customer base.

  • For an instance, in May 2020, UTAC Holdings Ltd and AEM Holdings Ltd entered into a partnership to develop CMOS image sensor test systems and solution. Under this pairing, both companies will focus on providing cost effective test system solutions for CMOS image sensor products.

Key Companies Profiled

  • ASE Group, Inc.
  • Amkor Technology, Inc.
  • Siliconware Precision Industries Co., Ltd.
  • Powertech Technology, Inc.
  • United Test and Assembly Center Ltd.
  • JCET Group Co Ltd
  • ChipMOS Technologies
  • Jiangsu Changjiang Electronics Technology Co., Ltd.
  • Chipbond Technology Corporation

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Semiconductor Assembly and Testing Services Market Outlook by Category

By Services, Semiconductor Assembly and Testing Services Market Demand is segmented as:

  • Assembly & Packaging Services
    • Copper Wire and Gold Wire Bonding
    • Flip Chip
    • Wafer Level Packaging
    • TSV
    • Others
  • Testing Services

By Application, Semiconductor Assembly and Testing Services Market Outlook is segmented as:

  • Communications
  • Computing & Networking
  • Consumer Electronics
  • Industrial
  • Automotive Electronics

By Region, Semiconductor Assembly and Testing Services Market is segmented as:

  • North America
  • Latin America
  • Western Europe
  • Eastern Europe
  • Asia Pacific Excluding Japan
  • Japan
  • Middle East and Africa (MEA)

Table of Content

1. Executive Summary

1.1. Global Market Outlook

1.2. Demand Side Trends

1.3. Supply Side Trends

1.4. Analysis and Recommendations

2. Market Overview

2.1. Market Coverage / Taxonomy

2.2. Market Definition / Scope / Limitations

3. Key Market Trends

3.1. Key Trends Impacting the Market

3.2. Product Innovation / Development Trends

4. Key Success Factors

4.1. Product Adoption / Usage Analysis

4.2. Product USPs / Features

4.3. Strategic Promotional Strategies

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About the Author

Nikhil Kaitwade

Associate Vice President at Future Market Insights, Inc. has over a decade of experience in market research and business consulting. He has successfully delivered 1500+ client assignments, predominantly in Automotive, Chemicals, Industrial Equipment, Oil & Gas, and Service industries.
His core competency circles around developing research methodology, creating a unique analysis framework, statistical data models for pricing analysis, competition mapping, and market feasibility analysis. His expertise also extends wide and beyond analysis, advising clients on identifying growth potential in established and niche market segments, investment/divestment decisions, and market entry decision-making.
Nikhil holds an MBA degree in Marketing and IT and a Graduate in Mechanical Engineering. Nikhil has authored several publications and quoted in journals like EMS Now, EPR Magazine, and EE Times.

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