In 2022, the liquid encapsulation market generated US$ 1.6 billion in revenue. The market is anticipated to grow at a CAGR of 5.1% from 2023 to 2033, reaching US$ 2.8 billion.
Liquid encapsulation is a technique that involves coating solid or liquid devices with materials like polymer, metal, and ceramics to shield them from shock and moisture. Devices employ liquid-encapsulated materials to guarantee proper operation and avoid electrical component misconnection. These encapsulated materials make use of epoxy resin and epoxy modified resin materials.
25.4% of the global encapsulation market is made up of liquid encapsulations.
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The liquid encapsulation market refers to the global market for materials and services used to protect electronic components and devices from environmental factors, such as moisture, dust, and temperature fluctuations. Liquid encapsulation involves the use of liquid materials, such as epoxy or silicone, to encapsulate electronic components and provide protection against environmental factors.
One of the main drivers of the liquid encapsulation market is the increasing demand for electronic devices in various end-use industries, such as consumer electronics, automotive, healthcare, and aerospace. Electronic devices are becoming more complex and miniaturized, and they require reliable protection against environmental factors to ensure long-term performance and reliability. Liquid encapsulation provides a cost-effective and reliable solution for protecting electronic devices in a variety of industries.
Another key driver of the market is the increasing adoption of advanced materials and technologies for liquid encapsulation. There has been significant development in the field of liquid encapsulation, with the introduction of new materials and technologies that offer enhanced protection and performance. For example, some liquid encapsulation materials offer improved thermal conductivity and electrical insulation, which can help to dissipate heat and reduce the risk of short circuits.
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Competitive Landscape
Increased adoption of technologically advanced electronic devices are arousing the demands for liquid encapsulation.
- In January 2023, Intel had launched the 4th Gen “Sapphire Rapids” Xeon Scalable processors, the Xeon CPU Max Series (codenamed “Sapphire Rapids HBM”), and the “Ponte Vecchio” data center max series GPU using liquid chip technology.
- In July 2020, Shin-Etsu Chemical Co., Ltd had launched a new improved type of silicone emulsions with a high level of purification technology. Such advancements are expected to drive the liquid encapsulation market.
Regional Analysis
North American region is analyzed to dominate the global liquid encapsulation market with the share of 24.4% in 2022 and South Asia Pacific region is growing at the fastest rate in the global liquid encapsulation market with the CAGR of 6.1% during the forecast period of 2022 to 2032.
Increased adoption of liquid encapsulation method for manufacturing sensors, as well as rising application of liquid encapsulation technology to manufacture innovative MEMS (Microelectromechanical) devices like completely spherical micro lenses are the key factors behind the market growth of liquid encapsulation market in the North American region.
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Liquid Encapsulation Market by Category
By Material:
- Epoxy resin
- Epoxy-modified resin
- Others
By Product:
- Integrated circuits
- Sensors
- Discrete semiconductors
- Optoelectronics
By Region:
- North America
- Latin America
- Europe
- East Asia
- South Asia & Pacific
- Middle East & Africa
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