The global moulded underfill material market is anticipated to reach US$ 8 billion in 2022 and grow at a CAGR of 5% through 2032. By the conclusion of the 2022–2032 assessment period, the market demand for moulded underfill material is anticipated to be worth US$ 13.03 billion.
The semiconductor business is growing thanks to its versatile products in a number of end user industries. The necessary packaging for semiconductor products was created as a result. Hence, moulded underfill materials are frequently used in the packaging of semiconductor products.
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Also, with the continued penetration of electrical devices, the use of moulded underfill materials is growing. Packaging has become more and more important throughout time, and so has our reliance on it.
Moulded underfill materials are used in a range of electrical applications due to their high reliability and low cost. Furthermore, the use of moulded underfill materials is being promoted through the development of flip chips. The sizes of electrical applications are drastically changing.
As a result, packaging has improved and there has been a change in how moulded underfill materials are employed. Since electrical applications require specialised packaging, the market for semiconductors and electrical appliances is highly benefited by the use of moulded underfilled materials.
Molded Underfill Material Market: Few Players
Few players identified in molded underfill material market are:-
- Henkel
- Won Chemicals Co. Ltd.
- Epoxy Technology Inc.
- AIM solder
- Namics Corporation
- Others
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Molded Underfill Material Market: Market Segmentation
The molded underfill material market is segmented into three parts based on technology types, application types, and geography.
Based on the technology type application molded underfill material market is segmented into:
- Differential Scanning Calorimeter (DSC)
- Thermo-gravimetrical Analyzer (TGA)
- Thermal Mechanical Analyzer (TMA)
- Coefficient of Thermal Expansion (CTE)
- Dynamic Mechanic Analyzer (DMA)
- Others
Based on the application molded underfill material market is segmented into:
- Flip chips
- Ball grid array (BGA)
- Chip scale packaging (CSP)
Key Benefits
- This report provides a quantitative analysis of the current Molded Underfill Material market trend, market opportunities, estimations, and dynamics of the [KEYWORD] market analysis from 2023 to 2033 to identify the prevailing Molded Underfill Material market opportunities.
The market research is offered along with information related to key drivers, restraints, and opportunities. - Porter’s five forces analysis highlights the potency of buyers and suppliers to enable stakeholders make profit-oriented business decisions and strengthen their supplier-buyer network.
- In-depth analysis of the Molded Underfill Material market segmentation assists to determine the prevailing market opportunities.
- Major countries in each region are mapped according to their revenue contribution to the global market.
- Market player positioning facilitates benchmarking and provides a clear understanding of the present position of the market players.
- The report includes the analysis of the regional as well as global electrostatic discharge (esd) packaging market trends, key players, market segments, application areas, and market growth strategies.
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