In 2022, the liquid encapsulation market generated US$ 1.6 billion in revenue. The market is anticipated to grow at a CAGR of 5.1% from 2023 to 2033, reaching US$ 2.8 billion.
Liquid encapsulation is a technique that involves coating solid or liquid devices with materials like polymer, metal, and ceramics to shield them from shock and moisture. Devices employ liquid-encapsulated materials to guarantee proper operation and avoid electrical component misconnection. These encapsulated materials make use of epoxy resin and epoxy modified resin materials.
25.4% of the global encapsulation market is made up of liquid encapsulations.
The main factors considered to speed up this process are the increasing complexity and operability of electronics devices as well as the rising trend towards miniaturised electrical components.
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The Needs for Liquid Encapsulation Technique Are Growing Rapidly Due to Trends Toward Miniaturized Semiconductor Devices
The demand for the liquid encapsulation technique is rising quickly due to the trend towards miniaturised semiconductor devices. The liquid encapsulation method is used in semiconductor device manufacturing for underfilling, cavity filling, advanced packaging, and glob top encapsulation. By making it possible to manage smaller and more complex device structures without sacrificing quality, it enhances miniaturised electronic devices.
Because of the small, precisely positioned components that make up electronics and semiconductor devices, market growth is anticipated. Additionally, liquid encapsulation is crucial for a device’s operation and helps prevent component failure in electronic devices, which hastened the development of liquid encapsulation systems.
Competitive Landscape
Increased adoption of technologically advanced electronic devices are arousing the demands for liquid encapsulation.
- In January 2023, Intel had launched the 4th Gen “Sapphire Rapids” Xeon Scalable processors, the Xeon CPU Max Series (codenamed “Sapphire Rapids HBM”), and the “Ponte Vecchio” data center max series GPU using liquid chip technology.
- In July 2020, Shin-Etsu Chemical Co., Ltd had launched a new improved type of silicone emulsions with a high level of purification technology. Such advancements are expected to drive the liquid encapsulation market.
Key Companies Profiled
- Henkel AG & Company KGaA
- BASF SE
- Panasonic Corporation
- Sanyu Rec Co. Ltd.
- Hitachi Chemical Co. Ltd.
- Resin Technical Systems
- Sumitomo Bakelite Co. Ltd.
- Kyocera Corporation
- Nitto Denko Corporation
- Shin-Etsu Chemical Co. Ltd.
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Regional Analysis
North American region is analyzed to dominate the global liquid encapsulation market with the share of 24.4% in 2022 and South Asia Pacific region is growing at the fastest rate in the global liquid encapsulation market with the CAGR of 6.1% during the forecast period of 2022 to 2032.
Increased adoption of liquid encapsulation method for manufacturing sensors, as well as rising application of liquid encapsulation technology to manufacture innovative MEMS (Microelectromechanical) devices like completely spherical micro lenses are the key factors behind the market growth of liquid encapsulation market in the North American region.
Growing demand for sensor devices, wireless technologies and optoelectronics has led to an increase in the usage of encapsulation methods are factors influencing market growth in South Asia Pacific region.
Liquid Encapsulation Market by Category
By Material:
- Epoxy resin
- Epoxy-modified resin
- Others
By Product:
- Integrated circuits
- Sensors
- Discrete semiconductors
- Optoelectronics
By Region:
- North America
- Latin America
- Europe
- East Asia
- South Asia & Pacific
- Middle East & Africa
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